Customization: | Available |
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Application: | Enterprise Level |
Max. CPUs: | 1 |
Shipping Cost: | Contact the supplier about freight and estimated delivery time. |
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Payment Methods: |
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Support payments in USD |
Secure payments: | Every payment you make on Made-in-China.com is protected by the platform. |
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Refund policy: | Claim a refund if your order doesn't ship, is missing, or arrives with product issues. |
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Feature
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Technical Specifications
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Processor
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• 24 DDR5 DIMM slots, supports RDIMM 6 TB max, speeds up to 4800 MT/s • Supports registered ECC DDR5 DIMMs only
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Storage controllers
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• Internal Controllers: PERC H965i, PERC H755, PERC H755N, PERC H355, HBA355i • Internal Boot: Boot Optimized Storage Subsystem
(BOSS-N1): HWRAID 2 x M.2 NVMe SSDs or USB • External HBAs (non-RAID): HBA355e • Software RAID: S160 |
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Drive Bays
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Front bays: • Up to 4 x 3.5-inch SAS/SATA (HDD/SSD) max 80 TB
• Up to 8 x 2.5-inch NVMe (SSD) max 122.88 TB • Up to 10 x 2.5-inchSAS/SATA/NVMe (HDD/SSD) max 153.6 TB • Up to 14 x E3.S NVMe direct drives max 89.6 TB • Up to 16 x E3.S NVMe direct drives max 102.4 TB Rear bays: • Up to 2 x 2.5-inch SAS/SATA (HDD/SSD) max 30.72 TB • Up to 2 x E3.S NVMe direct drives max 12.8 TB |
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Power Supplies
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• 1800 W Titanium 200-240 VAC or 240 HVDC, hot swap redundant • 1400 W Mixed mode 100-240 VAC or 240 HVDC, hot swap redundant
• 1100 W Mixed mode 100-240 VAC or 240 HVDC, hot swap redundant • 1100 W LVDC -48 - -60 VDC, hot swap redundant • 800 W Platinum 100-240 VAC or 240 HVDC , hot swap redundant |
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Cooling Options
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• Air cooling • Optional Direct Liquid Cooling (DLC) Note: DLC is a rack solution and requires rack manifolds and a cooling distribution unit
(CDU) to operate. |
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Fans
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• Standard (STD) fans/High performance Gold (VHP) fans • Up to 4 sets (dual fan module) hot plug fans
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Dimensions
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• Height - 42.8 mm (1.685 inches) • Width - 482.0 mm (18.97 inches)
• Depth - 822.89 mm (32.4 inches) with bezel 809.05 (31.85 inches) without bezel |
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Form Factor
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1U Rack server
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Bezel
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Optional LCD bezel or security bezel
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Security
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• AMD Secure Encrypted Virtualization (SEV) • AMD Secure Memory Encryption (SME)
• Cryptographically signed firmware • Data at Rest Encryption (SEDs with local or external key mgmt) • Secure Boot • Secured Component Verification (Hardware integrity check) • Secure Erase • Silicon Root of Trust • System Lockdown (requires iDRAC9 Enterprise or Datacenter) • TPM 2.0 FIPS, CC-TCG certified, TPM 2.0 China NationZ |
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Embedded NIC
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2 x 1 GbE LOM card (optional)
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Network options
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1 x OCP 3.0 card (optional) Note: The system allows either LOM card or an OCP card or both to be installed in the system.
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GPU Options
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3 x 75 W SW
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PCIe
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Up to three PCIe slots • Slot 1: 1 x16 Gen5 or 1 x16 Gen4 Low profile, Half length or 1 x16 Gen5 Full height, Half length
• Slot 2: 1 x16 Gen5 or 1 x16 Gen4 Low profile, Half length or 1 x16 Gen5 Full height, Half length • Slot 3: 1 x16 Gen5 or1 x16 Gen4 Low profile, Half length |
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